Advanced Packaging for R&D and Production
Made in Germany
Our latest white paper about advanced packaging.
Active alignment for photonics systems
Tresky Automation takes active alignment in photonics systems to a new level. The machine platforms combine nanometer precision, modular processes, and maximum flexibility for research, development, and industrial manufacturing of optoelectronic assemblies.
Digital Beamsplitter for high-precision Advanced Packaging
With the Digital Beamsplitter, Tresky offers an innovative option for the visual alignment of high-precision DIE-bonding processes. Instead of combining the images using a conventional optical beamsplitter, the image superposition is performed entirely via software. This reduces additional optical and mechanical variables in the beam path.
Developing high precisions processes and solutions for advanced packaging applications worldwide.
At Tresky, we develop innovative DIE bonding processes and customized solutions for advanced packaging applications worldwide. Combining precision bonding technology with extensive process expertise, we support our customers in meeting the increasing demands of semiconductor manufacturing, photonics, and microelectronics. Our focus is on delivering flexible, reliable, and highly accurate bonding solutions for next-generation packaging technologies.
Latest News and Events
Find out about the latest news and upcoming events from Tresky in the field of DIE bonding technology.
