Products
Reliable DIE bonder solutions for current and future electronic products
Products
Epoxy / Adhesive Bonder
UV Bonder
Ultrasonic Bonder
Thermocompression Bonder
Sinter Bonder
Flip Chip Bonder
Eutectic Bonder
3D Bonder
Photonics Bonder
Platforms
T-6000-L
T-6000-L/G
T-7000
T-8000-G
Options
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Features
Manual mode
Why Granite?
Industries
Applications & Technologies
Find out more about DIE bonding processes and their possible applications.
Applications
Epoxy/Adhesive Die Bonding
UV DIE Bonding
Ultrasonic Bonding (US Bonding)
Thermocompression Bonding (TC Bonding)
Metallic Sinter Bonding
Dispensing of Tacking Agent for High Power Module assembly
DIE Stacking
Flip Chip Bonding
DIE Sorting
Eutectic Bonding
Technologies
DIE Bonding is the permanent connection of a semiconductor chip to a substrate, package, wafer or component. Find out more about the individual DIE bonding processes.
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Hotline
Do you have any questions about the processes and possible applications? Please contact us.
Phone: +49 (0) 3302 86692-30
Fax: +49 (0) 3302 86692-99
Mobile: +49 (0) 172 847 0249
E-mail: support@tresky.de
Services & Support
We are one of the world's leading manufacturers of high-precision placement machines with 40 years of experience in the semiconductor market.
Hotline
Phone: +49 (0) 3302 86692-30
Fax: +49 (0) 3302 86692-99
Mobile: +49 (0) 172 847 0249
E-mail: support@tresky.de
Services
Our contract services in the Contract Manufacturing Hub
Prototyping & Small Series Production
DIE Sorting
Process Development
Worldwide reliable!
With 3 locations and countless agencies worldwide, we have a broad network of technicians. This means you receive competent first-hand advice, fast and punctual delivery and a solution tailored to your problem.
Support
Contact us
We look forward to getting in touch with you. Our international team is always available for technical questions, service calls or further information on our products.
Europe
Phone: +49 (0) 3302 866 92-0
E-mail: info@tresky.de
Your personal
contact
Contact us
Asia
Phone: +886 932 206253
E-mail: eagle@tresky.de
International
Contact
International Contact
America
Phone: +1 (732) 536-8600
Mobile: +1 (732) 547-9677
E-mail: a.weil@tresky.de
Service  contact
Phone: +49 (0) 3302 86692-30
Fax: +49 (0) 3302 86692-99
Mobile: +49 (0) 172 847 0249
E-mail: support@tresky.de
News
We keep you up to date with the latest developments from our company through our news, our newsletter and the various trade fairs and events we attend each year.
News
Overview of our latest press releases
News
Downloads
Important
product information
Downloads
FAIRS & EVENTS
Overview of our trade fair appearances and events
Events
References
Innovation drives sustainable development and inspiration
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Company
We are a leading global manufacturer of high-precision assembly systems with 40 years of experience in the semiconductor industry
Company
We stand for the highest quality, unmatched flexibility with maximum reliability
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Events

An overview of our trade fair appearances and events

As a leading company in the field of DIE bonding, we regularly take part in global trade fairs and events related to the semiconductor industry to present our latest products and innovations. Please contact us in advance for a personal appointment. Here you will find an overview of our upcoming trade fair participations: