Highest machine precision thanks to Mother Nature
Particularly when it comes to the highest precision requirements, machine builders from different industries like to rely on a material that is thousands of years old, from the depths of the earth: granite. Particularly when the components to be processed are extremely small, precision comes into even stronger focus, as in the semiconductor industry with DIE bonding.
Perfect connection
The DIE bonding process Thermosonic Bonding (TSB) combines the novel thermocompression bonding with ultrasonic welding (UW).
Rework of LED dies using debonding solution from Tresky Automation
In times of limited availability of components and materials, reworking takes on a very special significance. This also applies to LED manufacturing, where irregularities in processed LEDs are immediately visible at first sight.
Tresky offers DIE bonding prototyping and small series production
In the prototyping phase and when producing small series or batch size 1, many companies shy away from investing in their own Die-Bonder.
Air-bearing bond head, new vibrating feeders and a new wafer handling system
Tresky GmbH will showcase three new options for its die bonders during SMTconnect in Nuremberg, Germany, May 10-12, 2022, in Hall 4A, Booth 234: a new precision placement head, a vibrating feeder and a new wafer handler.