T-6000-L/G
The Best Bonding Performance
The Art of Engineering
Based on the proven T-6000-L series, the DIE bonder T-6000-L/G has been further developed. This consists of a stable granite gantry and a high-precision control system for the X, Y and Z axes. The system therefore offers the best bonding performance in the market and is designed for the current and future challenges in the semiconductor industry.
Technical Data
| Travel Range with Wafer | 400 mm x 410 mm |
| Wafer Size | 2” – 8” (Ring & Frame) |
| Travel Range w/o Wafer | 540 mm x 410 mm |
| Z-Movement | 100 mm |
| Chip Rotation Max. | up to 360° |
| Bond Force Range | 0.01 N – bis zu 100 N * |
| Axis Speed | up to 1.8 m/sec |
| Placement Accuracy | 2.5 μm @ 3 sigma |
| Axis Resolution | XYZ: 0.01 μm, Theta: 0.01° |
| Min./Max. Component Size | 80 μm – 100 mm ** |
* Higher bond forces on request
** Other dimensions on request | Note: All specifications are subject to change without prior notice
All Common Connection Technologies
The T-6000-L/G guarantees reproducible and accurate results for highly precise placement applications. Optionally, the T-6000- L/G can be upgraded with a loading and unloading module to further optimize cycle times and to reduce downtime.
Due to the wide range of process options, the T-6000-L/G offers high versatility in combination with speed and high precision. The system can be further expanded at any time with additional options. Thus, our customers receive an individual system tailored to their needs, with which both manual and fully automatic processes can be implemented reliably and effectively. The intuitive software enables simple and easy operation and programming of the system.
This model covers all common connection technologies.
Data Sheet
Product
Highlights
- Manual mode
- Multichip capable
- Post-bond-inspection
- Software programmed temperature control
- Wafer mapping
- OCR
- Traceability
- MES
- Automated dispensing needle calibration
- Customized partitioning
- Scrubbing
- Different image recognition
- Bondin in Cavities (15 mm)
- Preform Punching
Modules and
Options
- Air bearing bond head
- Vibrating feeder
- Wafer handling system
- Stamping module
- Component feeders
- Formic Acid Module
- Wafer table with DIE ejector
- UV-indexer
- WRGB ring light
- Heating plates (up to 450°C; ΔT-Ramps up to 60 K/s)
- Inert gas
- Automatic tool change
- Various dispensing technologies
- Tool heating
- Various feeder widths
- Uplooking camera
- ID-scanner
- DIE flipping-unit
- Heated inert gas
- Magazine feeder
- Inline production
Customized
Applications
- DTF / DAF bonding
- Multi-DIE bonding
- MEMS
- SMD bonding
- 3D-packaging (SiP)
- Laser-bar-stacking
- Glass bonding
- TO header bonding
- Vcsel bonding
- RFID assembly
- DIE sorting