T-8000-G
Versatility and Accuracy
The Art of Engineering
The T-8000-G DIE bonder is the result of continuous engineering development and offers a larger working area in which 12-inch wafers can be processed. The bonding system combines precision with versatility and speed based on a generously sized granite gantry that allows for maximum accuracy. Thus, the T-8000-G is designed for current and future challenges.
Technical Data
| Travel Range with Wafer | 590 mm x 560 mm |
| Wafer Sizes | 2” – 12” (ring & frame) |
| Travelling Range w/o Wafer | 740 mm x 560 mm |
| Z-Movement | 120 mm |
| Chip Rotation max. | up to 360° |
| Bond Force Range | 0.01 N – bis zu 100 N * |
| Axis Speed | up to 1.8 m/sec |
| Positioning Accuracy | 2.5 μm @ 3 sigma |
| Axis Resolution | XYZ: 0.001 μm, theta: 0.005° |
| Min/Max. Chip Size | smaller than 0.05 mm |
* Higher bond forces on request
From Prototype to Production
Based on the solid granite chassis, equipped with linear motors and high-resolution direct measuring systems, the machine offers the largest working range within the product portfolio as well as the best bonding performance in the market. In addition, the T-8000-G is compatible with numerous existing as well as custom-made options and offers the most versatile process possibilities. The bonder can handle any application in assembly and connection technology and combines precision, versatility and speed. Due to its flexibility and modularity, the T-8000-G can be used for prototyping as well as for series production. The manual mode enables fast bonding results without programming.
This model covers all common bonding technologies.
Data Sheet
Product
Highlights
- Manual mode
- Multichip capable
- Post-bond-inspection
- Software programmed temperature control
- Wafer mapping
- OCR
- Traceability
- MES
- Automated dispensing needle calibration
- Customized partitioning
- Scrubbing
- Different image recognition
- Bonding in cavities (15 mm)
- Preform punching
Moduls und
Options
- Air bearing bond head
- Vibrating feeder
- Wafer handling system
- Stamping module
- Component feeders
- Formic Acid Module
- Wafer table with DIE ejector
- UV-indexer
- WRGB ring light
- Heating plates (up to 450°C; ΔT-Ramps up to 60 K/s)
- Inert gas
- Automatic tool change
- Various dispensing technologies
- Tool heating
- Various feeder widths
- Uplooking camera
- ID-scanner
- DIE flipping-unit
- Heated inert gas
- Automatic wafer change
- Magazine feeder
- Inline production
Customized
Applications
- DTF / DAF bonding
- Multi-DIE bonding
- MEMS
- SMD bonding
- 3D-packaging (SiP)
- Laser-bar-stacking
- Glass bonding
- TO Header bonding
- Vcsel bonding
- RFID assambly
- DIE sorting