Photonics Bonder

Technological miniaturisation and functional integration in nano- and optoelectronics are decisive for future-oriented product innovations. Positioning accuracy and reproducibility of complex microsystems are a prerequisite for quality and reliability of these products in the manufacturing and assembly process. Special attention must be paid to the assembly and connection technology.

We have developed the photonics bonder to successfully fulfil these requirements. The bonder offers sub-micron placement accuracy, a  travel range of 500 x 700 mm and a bonding head with minimum bonding force of 0.01 N. On customer request, the bonding force range can be optionally increased to 100 N, 300 N or 500 N. As is standard for us, we use granite as machine basis here, so that the highest possible precision can be guaranteed for optical components such as VCSELs, lasers, photodiodes, IR sensors or for the development of quantum technologies.