DIE Transfer Film process (DTF)
DTF - A flexible and versatile process for different DIE sizes
The DIE Transfer Film process is characterized in the chip integration by the use of a thin silver sintering layer known as a transfer film. This process ensures precise adhesion of the chip to substrates and creates a high purity bond with excellent thermal and electrical conductivity after sintering. Learn how this innovative approach increases efficiency and reliability in sinter bonding.
Sintering with the DTF Process
During the DIE transfer film process, a thin silver sinter layer, a so-called transfer film is first picked up with the DIE. The picked chip is pressed into the film with a defined force and temperature. When the component is subsequently lifted, a uniformly thick, defined layer is released from the film. Due to the good adhesion the layer remains adhered to the underside of the chip. The chip coated in this way is then placed on the Ag or Au pad of the DBC or AMB substrate and fed into the sintering process. After sintering, a high-purity bond is formed between the component and the surface, which exhibits excellent thermal and electrical conductivity.