Process Videos
Use of a two-track conveyor system
Unprocessed substrates and SiC MOSFETs can be transported simultaneously into the sintering bonder, by using a two conveyor systems. In this way, the feeding of additional SiC MOSFETs as well as the removal of finished packages can take place automatically and with optimized cycle times.
Dispensing the sintering paste using a SQ-Nozzle
The SQ-Nozzle developed by Tresky allows a sequential and very precise large-area application of deposits of silver or copper sintering paste. The paste is applied to each substrate in one process step, whereby defined layer heights and thicknesses can be applied, which are controlled by measuring the layer thickness.
Layer thickness measurement of sintering paste by laser
By means of a triangulation laser, the layer thickness of the applied sintering paste is measured without contact. In the process, a distance measurement is carried out by calculating the angle. This guarantees that the dispensing applies the predefined amount of paste and thus reproducible sintering results are achieved.
Applying of a tacking agent to fix SiC MOSFETs
To prevent the SiC MOSFETs from slipping from the sinter bonder during transport to the sinter press, an alcohol-based tacking agent is applied. This evaporates without leaving any residue during the sintering process.
Pickup and placement of SiC MOSFETs
After the layer thickness measurement, the SiC MOSFETs are picked from the tray and placed in the applied sintering paste. A previously applied tacking agent fixes the SiC MOSFET in the sintering paste and prevents it from moving during transport to the sintering press.